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          半導體加工行業

          應用于單晶硅、多晶硅、藍寶石等的切割、開方、鉆孔、外圓磨、端面磨,

          金剛石工具如:切割片、帶鋸、取芯鉆頭、磨輪等,

          一般采用GMD、GRD金剛石


          應用于單晶硅、多晶硅、藍寶石等的劃片、線切割、倒角、研磨、拋光,
          金剛石工具如:超薄切割片、線鋸、倒角輪、研磨輪、拋光輪等,

          一般采用GMP金剛石微粉

           

          CMP拋光墊修整器,適合選用我司創新產品——GMT尖晶金剛石




          清纯白丝学生脱裙子自慰
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